Investigation of electromigration on printed circuit boards soldered with lead-free solder

K. Kiełbasiński; J. Kalenik; R. Kisiel

doi:10.1117/12.714554

Translator Disclaimer

12 October 2006 Investigation of electromigration on printed circuit boards soldered with lead-free solder

K. Kiełbasiński, J. Kalenik, R. Kisiel

Author Affiliations +

Proceedings Volume 6347, Photonics Applications in Astronomy, Communications, Industry, and High-Energy Physics Experiments 2006; 63471V (2006) https://doi.org/10.1117/12.714554
Event: Photonics Applications in Astronomy, Communications, Industry, and High-Energy Physics Experiments 2006, 2006, Wilga, Poland

Abstract

The electromigration on printed circuit test boards after soldering process was under investigation. FR-4 laminate, that is the most popular laminate for printed circuit boards fabrication, with 35mm thick copper layer was used in the test. Six various solders were applied in this work, which differed with silver content from each other. Some solder contained lead and copper. For electromigration assessment two tests were performed: Surface Insulation Resistance Test and Water-Drop Test. Silver presence in the solder do not decreased insulation resistance of test printed circuit boards. This implies, that small silver content in a solder does not increase electromigration of solder material. The "Water drop" test showed, that silver addition decreases electrochemical migration in continuous water layer on printed circuit board surface.

Citation Download Citation

K. Kiełbasiński, J. Kalenik, and R. Kisiel "Investigation of electromigration on printed circuit boards soldered with lead-free solder", Proc. SPIE 6347, Photonics Applications in Astronomy, Communications, Industry, and High-Energy Physics Experiments 2006, 63471V (12 October 2006); https://doi.org/10.1117/12.714554

ACCESS THE FULL ARTICLE