20 October 2006 Bonding technique of polymer layer with ceramic elements of analytical microsystems
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Proceedings Volume 6348, Optoelectronic and Electronic Sensors VI; 63480P (2006) https://doi.org/10.1117/12.721108
Event: Optoelectronic and Electronic Sensors VI, 2006, Zakopane, Poland
The possibilities of the construction of microsystems using ceramics and polymers are presented in the paper. The technology of irreversible and reversible bonding of ceramic and polymer microsystems' layers was developed. The irreversible bonding is required only for microfluidic structures, in which samples and reagents are introduced into the system using pressure methods. For the systems with an electroosmotic reagents dosing adhesion forces between particular layers are enough to seal the microchannels. In both cases a glaze layer was screen-printed on ceramic plates to eliminate their surface roughness.
© (2006) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Michał Chudy, Karol Malecha, Leszek Golonka, Adam Sosicki, Henryk Roguszczak, Małgorzata Jakubowska, Artur Dybko, Zbigniew Brzózka, "Bonding technique of polymer layer with ceramic elements of analytical microsystems", Proc. SPIE 6348, Optoelectronic and Electronic Sensors VI, 63480P (20 October 2006); doi: 10.1117/12.721108; https://doi.org/10.1117/12.721108


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