20 October 2006 An ultra-uniform ultra-thin resist deposition process
Author Affiliations +
Proceedings Volume 6349, Photomask Technology 2006; 634907 (2006); doi: 10.1117/12.685640
Event: SPIE Photomask Technology, 2006, Monterey, California, United States
Abstract
An ultra-uniform, ultra-thin resist deposition process is presented. Nanometrix applications development with Ultra Thin Polymer Films (UTPF) production process addresses several problems related to resist deposition for lithographic applications. The linear coating process based on the Schneider-Picard (SP) method is a driven assembly process. Linear meter per minute coating rates are produced while providing an outstanding film quality at nano- to micro scale thinness. Therefore, this coating method provides a viable alternative for resist application. Our present developments on nano and micro ultra-thin polymer film coatings give substantial new solutions for improved, faster and less expensive coating production. Materials, writing and quality control costs may be substantially reduced with UTPF deposition technology. Results from three resists are presented in this paper. E-beam direct writing on 8 nm PMMA and photolithography on ILine and DUV resists in the scale of 30 nm are presented. Thicker resist deposition has been performed as well in the range of 1-10 microns thick. Film edge bead in the order of film thickness are obtained (1000 x smaller than spin coating process). Substrates were all coated with uniform ultra-thin films at a rate of one square meter per minute with atomic smoothness. This technological breakthrough enables a valuable solution for resist deposition and lithography fabrication at the nano and micro scales and provides resist uniformity required for current and future critical dimension specifications.
© (2006) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Gilles Picard, Juan Schneider, Brian J. Grenon, "An ultra-uniform ultra-thin resist deposition process", Proc. SPIE 6349, Photomask Technology 2006, 634907 (20 October 2006); doi: 10.1117/12.685640; https://doi.org/10.1117/12.685640
PROCEEDINGS
8 PAGES


SHARE
KEYWORDS
Coating

Polymers

Lithography

Polymethylmethacrylate

Surface plasmons

Deep ultraviolet

Photoresist processing

Back to Top