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20 October 2006 Sulfur-free cleaning strategy for advanced mask manufacturing
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Abstract
Existing cleaning technology using sulfuric acid based chemistry has served the mask industry quite well over the years. However, the existence of residue on mask surfaces is becoming more and more of a problem at the high energy wavelengths used in lithography tool for wafer manufacturing. This is evident by the emergence of sub-pellicle defect growth and backside hazing issues. A large source of residual contamination on the surface of masks is from the mask manufacturing process, particularly the cleaning portion involving sulfuric acid. Cleaning strategies can be developed that eliminate the use of sulfuric acid in the cleaning process for advanced photomasks and alternative processes can be used for cleaning masks at various stages of the manufacturing process. Implementation of these new technologies into manufacturing will be discussed as will the resulting improvements, advantages, and disadvantages over pre-existing mask cleaning processes.
© (2006) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Louis Kindt, Andrew Watts, Jay Burnham, and William Aaskov "Sulfur-free cleaning strategy for advanced mask manufacturing", Proc. SPIE 6349, Photomask Technology 2006, 63491J (20 October 2006); https://doi.org/10.1117/12.686228
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