6 October 2006 Integration of optical isolators and semiconductor lasers by wafer bonding
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Proceedings Volume 6352, Optoelectronic Materials and Devices; 63522B (2006) https://doi.org/10.1117/12.687371
Event: Asia-Pacific Optical Communications, 2006, Gwangju, South Korea
Abstract
We developed a technique of bonding magneto-optic garnets to III/V compound semiconductors for integrating an optical isolator with a semiconductor optical device. Some approaches to realize an isolator integrated with a laser diode will be presented.
© (2006) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Tetsuya Mizumoto, Tetsuya Mizumoto, Kazumasa Sakurai, Kazumasa Sakurai, Yuya Shoji, Yuya Shoji, Hideki Saito, Hideki Saito, } "Integration of optical isolators and semiconductor lasers by wafer bonding", Proc. SPIE 6352, Optoelectronic Materials and Devices, 63522B (6 October 2006); doi: 10.1117/12.687371; https://doi.org/10.1117/12.687371
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