Integration of optical isolators and semiconductor lasers by wafer bonding

Tetsuya Mizumoto; Kazumasa Sakurai; Yuya Shoji; Hideki Saito

doi:10.1117/12.687371

6 October 2006 Integration of optical isolators and semiconductor lasers by wafer bonding

Tetsuya Mizumoto, Kazumasa Sakurai, Yuya Shoji, Hideki Saito

Author Affiliations +

Proceedings Volume 6352, Optoelectronic Materials and Devices; 63522B (2006) https://doi.org/10.1117/12.687371
Event: Asia-Pacific Optical Communications, 2006, Gwangju, South Korea

Abstract

We developed a technique of bonding magneto-optic garnets to III/V compound semiconductors for integrating an optical isolator with a semiconductor optical device. Some approaches to realize an isolator integrated with a laser diode will be presented.

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Tetsuya Mizumoto, Tetsuya Mizumoto, Kazumasa Sakurai, Kazumasa Sakurai, Yuya Shoji, Yuya Shoji, Hideki Saito, Hideki Saito, "Integration of optical isolators and semiconductor lasers by wafer bonding", Proc. SPIE 6352, Optoelectronic Materials and Devices, 63522B (6 October 2006); doi: 10.1117/12.687371; https://doi.org/10.1117/12.687371

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