6 October 2006 Integration of optical isolators and semiconductor lasers by wafer bonding
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Proceedings Volume 6352, Optoelectronic Materials and Devices; 63522B (2006) https://doi.org/10.1117/12.687371
Event: Asia-Pacific Optical Communications, 2006, Gwangju, South Korea
Abstract
We developed a technique of bonding magneto-optic garnets to III/V compound semiconductors for integrating an optical isolator with a semiconductor optical device. Some approaches to realize an isolator integrated with a laser diode will be presented.
© (2006) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Tetsuya Mizumoto, Tetsuya Mizumoto, Kazumasa Sakurai, Kazumasa Sakurai, Yuya Shoji, Yuya Shoji, Hideki Saito, Hideki Saito, "Integration of optical isolators and semiconductor lasers by wafer bonding", Proc. SPIE 6352, Optoelectronic Materials and Devices, 63522B (6 October 2006); doi: 10.1117/12.687371; https://doi.org/10.1117/12.687371
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