13 October 2006 Intelligent force control of a microchip packaging system
Author Affiliations +
Proceedings Volume 6376, Optomechatronic Micro/Nano Devices and Components II; 63760A (2006) https://doi.org/10.1117/12.687304
Event: Optics East 2006, 2006, Boston, Massachusetts, United States
In this paper, we developed a new mounting head system for a microchip such as flip chip. The proposed head system consists of a macro/micro positioning actuator for stable force control. The macro actuator provide the system with a gross motion while the micro device yields fine tuned motion to reduce the harmful impact force that occurs between very small sized electronic parts and the surface of a PCB(printed circuit board). In order to show the effectiveness of the proposed macro/micro mounting system, we compared the proposed system with the conventional mounting head equipped with a macro actuator only. A series of experiments were executed under the mounting conditions such as various access velocities and PCB stiffness. As a result of this study, a satisfactory voice coil actuator as the micro actuator has been developed , and its performance meet well the specifications desired for the design of the microchip mounting head system and show good correspondence between theoretical analysis and experimental results.
© (2006) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Jae Hong Shim, Jae Hong Shim, Young-Im Cho, Young-Im Cho, } "Intelligent force control of a microchip packaging system", Proc. SPIE 6376, Optomechatronic Micro/Nano Devices and Components II, 63760A (13 October 2006); doi: 10.1117/12.687304; https://doi.org/10.1117/12.687304


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