Rapid micro-optical prototyping technology for fabricating optical interconnection modules at the MCM and PCB level

C. Debaes; M. Vervaeke; J. Van Erps; L. Desmet; H. Ottevaere; V. Gomez; P. Vynck; S. Van Overmeire; Y. Ishii; A. Hermanne; H. Thienpont

doi:10.1117/12.687168

2 October 2006 Rapid micro-optical prototyping technology for fabricating optical interconnection modules at the MCM and PCB level

C. Debaes, M. Vervaeke, J. Van Erps, L. Desmet, H. Ottevaere, V. Gomez, P. Vynck, S. Van Overmeire, Y. Ishii, A. Hermanne, H. Thienpont

Author Affiliations +

Proceedings Volume 6393, Nanophotonics for Communication: Materials, Devices, and Systems III; 639302 (2006) https://doi.org/10.1117/12.687168
Event: Optics East 2006, 2006, Boston, Massachusetts, United States

Abstract

One of the remaining challenges to solve the interconnection bottlenecks at the Printed Circuit Board (PCB) and Multi-Chip-Module (MCM) level, is to adequately replace the galvanic interconnects with high-performance, low-cost, compact and reliable micro-photonic alternatives. At our labs of the Vrije Universiteit Brussel we are therefore optimizing and deploying a rapid micro-optical prototyping technology for micro-optical interconnect modules, which we call Deep Proton Writing (DPW). An advantage of the DPW process is that it can create steep micro-optical surfaces, micro-holes, micro-lenses and alignment features in one irradation step. Hence, relative accuracies are very well controlled. In this report, we will address more specifically the following components, made each with the DPW technology: 1) out-of-plane couplers for optical wave-guides embedded in PCB, 2) peripheral fiber ribbons and two dimensional single- and multimode fiber connectors for high-speed parallel optical connections, and 3) intra-MCM level optical interconnections via free-space optical modules. We will give special attention to the optical tolerancing and the opto-mechanical integration of components in their packages. We use both a sensitivity analysis to misalignment errors and Monte-Carlo simulations. It is our aim to investigate the whole component integration chain from the optoelectronic device packaging to the micro-opto-mechanical assembly of the interconnect module.

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C. Debaes, M. Vervaeke, J. Van Erps, L. Desmet, H. Ottevaere, V. Gomez, P. Vynck, S. Van Overmeire, Y. Ishii, A. Hermanne, and H. Thienpont "Rapid micro-optical prototyping technology for fabricating optical interconnection modules at the MCM and PCB level", Proc. SPIE 6393, Nanophotonics for Communication: Materials, Devices, and Systems III, 639302 (2 October 2006); https://doi.org/10.1117/12.687168

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KEYWORDS

Polymethylmethacrylate

Optical interconnects

Free space optics

Ions

Prototyping

Waveguides

Connectors

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