This paper discusses progress in the development of a new generation of passive infrared (PIR) security sensors for the
high volume military, industrial and consumer markets. Recent work on patented sensor technology is described,
including the mosaic pixel focal plane array concept (MP-FPA), which enables enhanced sensor performance to be
achieved with low cost optics and cheap packaging.
MOEMS technology is employed for fabrication of silicon microbolometer detector arrays, which are integrated on-chip
with a CMOS readout integrated circuit, and can be fabricated by large scale production methods in a silicon-based
MEMS foundry. The paper addresses the application of this technology to PIR security sensors.