Emerging 3D-SiP technologies and high volume MEMS applications require high productivity mass production DRIE
systems. The Alcatel DRIE product range has recently been optimized to reach the highest process and hardware
production performances. A study based on sub-micron high aspect ratio structures encountered in the most stringent 3D-SiP
has been carried out.
The optimization of the Bosch process parameters have shown ultra high silicon etch rate, with unrivaled uniformity and
repeatability leading to excellent process yields. In parallel, most recent hardware and proprietary design optimization
including vacuum pumping lines, process chamber, wafer chucks, pressure control system, gas delivery are discussed. A
key factor for achieving the highest performances was the recognized expertise of Alcatel vacuum and plasma science
These improvements have been monitored in a mass production environment for a mobile phone application. Field data
analysis shows a significant reduction of cost of ownership thanks to increased throughput and much lower running
costs. These benefits are now available for all 3D-SiP and high volume MEMS applications. The typical etched patterns
include tapered trenches for CMOS imagers, through silicon via holes for die stacking, well controlled profile angle for
3D high precision inertial sensors, and large exposed area features for inkjet printer head and Silicon microphones.