1 November 2007 Effect of geometry on thermoelastic damping in MEMS
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Proceedings Volume 6423, International Conference on Smart Materials and Nanotechnology in Engineering; 642307 (2007); doi: 10.1117/12.779199
Event: International Conference on Smart Materials and Nanotechnology in Engineering, 2007, Harbin, China
Abstract
The effects of geometry on the energy dissipation induced by thermoelastic damping in MEMS resonators are investigated numerically using a finite element formulation. The perturbation analysis is applied to derive a linear eigenvalue equation for the exponentially decaying rate of the mechanical oscillation. The analysis also involves a Fourier method that reduces the dimensionality of the problem and considerably improves the computational efficiency. The method is first validated by comparing the two-dimensional model to the existing analytical solutions for a simply supported beam system, and then it is extended to a three-dimensional axisymmetric geometry to obtain the energy loss as a function of the geometric parameters in a silicon ring resonator. The computational results reveal that there is a peak value for the resonant frequency when the radial width of the ring varies. In addition, the quality factor (Q-factor) decreases with the radial width as a monotonic function.
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Yun-Bo Yi, "Effect of geometry on thermoelastic damping in MEMS", Proc. SPIE 6423, International Conference on Smart Materials and Nanotechnology in Engineering, 642307 (1 November 2007); doi: 10.1117/12.779199; https://doi.org/10.1117/12.779199
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KEYWORDS
3D modeling

Chemical elements

Microelectromechanical systems

Resonators

Matrices

Silicon

Finite element methods

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