Paper
1 November 2007 A bulk micromachined gyroscope with improved quality-factors at atmospheric pressure
Weiping Chen, Hong Chen, Xiaowei Liu, Tian Han, Hao Wang
Author Affiliations +
Proceedings Volume 6423, International Conference on Smart Materials and Nanotechnology in Engineering; 642308 (2007) https://doi.org/10.1117/12.779200
Event: International Conference on Smart Materials and Nanotechnology in Engineering, 2007, Harbin, China
Abstract
This paper presents a bulk micromachined gyroscope with fully symmetric and doubly decoupled structure. The fully symmetric structure enables matched resonant frequencies of the drive and sense modes. The doubly decoupled mechanism, which reduces the cross-coupling and the quadrature error, is realized by independent and folded suspensions for restricting the drive and sense moveable fingers' degree of freedom (DOF). Additionally, the gyroscope has large quality factors even operating at atmospheric pressure, which is designed by utilizing slide film damping effects in drive and sense modes. Simulation results show that the resonant frequency for the drive and sense modes are 2776Hz and 2777Hz, respectively, and the cross-coupling is less than 0.2%. The gyroscope chip is fabricated by silicon-glass anodic bonding and deep reactive ion etch (DRIE) technology. The fabricated gyroscope has a structure thickness of 80 μm and a whole chip size of 5.5×5.5 mm2. The gyroscope has a static sense capacitance of 3.5 pF with minimum capacitive gaps of 4 μm. The measured resonant frequency with damping is 2581 Hz with the quality factor of 195 at atmospheric pressure.
© (2007) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Weiping Chen, Hong Chen, Xiaowei Liu, Tian Han, and Hao Wang "A bulk micromachined gyroscope with improved quality-factors at atmospheric pressure", Proc. SPIE 6423, International Conference on Smart Materials and Nanotechnology in Engineering, 642308 (1 November 2007); https://doi.org/10.1117/12.779200
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KEYWORDS
Gyroscopes

Microelectromechanical systems

Capacitance

Deep reactive ion etching

Silicon

Atmospheric sensing

Etching

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