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1 November 2007 Phase change materials at the cold/hot sides of thermoelectric cooler for temperature control
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Proceedings Volume 6423, International Conference on Smart Materials and Nanotechnology in Engineering; 642318 (2007) https://doi.org/10.1117/12.779364
Event: International Conference on Smart Materials and Nanotechnology in Engineering, 2007, Harbin, China
Abstract
The thermoelectric cooler (TEC) has many potential applications in aerospace. Due to its lower coefficient of performance (COP), TEC consumes much more power than a mechanic cooler with the same cooling capacity does. To increase the COP of TEC and to improve its work reliability, we attached encapsulated phase change materials (PCMs) to the cold/hot sides of TEC directly, and several temperature control structures were formed. Temperatures at the cold/hot sides of TECs would be maintained within a designed range. The temperature control performances of these structures were experimentally investigated. The results show that the use of PCM at the hot side of TEC prolongs its operation time over twice than that without PCM. And the COP of TEC is increased more than 100%. The temperature at the cold side of TEC rises dramatically with the power failure, but if the encapsulated PCM is attached to the cold side, this phenomenon will not happen. It is demonstrated that the use of PCM could significantly improve TEC's temperature control performance and work reliability.
© (2007) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Xiaoqun Wang, Jun Xu, Fang Zhang, and Shanyi Du "Phase change materials at the cold/hot sides of thermoelectric cooler for temperature control", Proc. SPIE 6423, International Conference on Smart Materials and Nanotechnology in Engineering, 642318 (1 November 2007); https://doi.org/10.1117/12.779364
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