1 November 2007 Thermal and electrical performance of α-Si microbolometer focal plane arrays
Author Affiliations +
Proceedings Volume 6423, International Conference on Smart Materials and Nanotechnology in Engineering; 64232D (2007) https://doi.org/10.1117/12.779855
Event: International Conference on Smart Materials and Nanotechnology in Engineering, 2007, Harbin, China
Abstract
Recent advances of microelectromechanical system (MEMS) technology have opened new opportunities for amorphous silicon (α-Si) microbolometer focal plane arrays (FPAs) both for military and civil applications. α-Si membrane is chosen for sensitive material of microbolometer FPAs due to its high temperature coefficient of resistance (TCR), high resistivity and good mechanical properties. However, α-Si membrane also has the disadvantage of high 1/f noise, strict preparation conditions and metastable effect. So nowadays, researches are focused on properties of α-Si membrane to gain high performance of microbolometer FPAs. Since the pulsed bias readout mode of microbolometer FPAs causes a non-steady-state of α-Si membrane during the operation, the transient thermal-electrical response process of the sensing pixel is analyzed detailedly in this paper to predict the thermal and electrical performance of α-Si microbolemeter FPAs such as responsivity, noise equivalent temperature difference (NETD), detectivity and power dissipation. Numerical simulations are presented to investigate the factor which affects the performance of α-Si microbolometer FPAs. The imaging experiment results obtained from a 320×240 α-Si microbolemeter FPA are in good agreement with the theoretical analysis. The way to improve the performance of α-Si microbolemeter FPAs is given in the end of this paper.
© (2007) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Lianjun Sun, Lianjun Sun, Benkang Chang, Benkang Chang, Junju Zhang, Junju Zhang, Yunsheng Qian, Yunsheng Qian, Yafeng Qiu, Yafeng Qiu, } "Thermal and electrical performance of α-Si microbolometer focal plane arrays", Proc. SPIE 6423, International Conference on Smart Materials and Nanotechnology in Engineering, 64232D (1 November 2007); doi: 10.1117/12.779855; https://doi.org/10.1117/12.779855
PROCEEDINGS
6 PAGES


SHARE
Back to Top