Paper
27 November 2007 Analysis and design for the thermo-smart structure of composite with TEC
Zhong-Min Deng, Xian-Li Cheng, Xiao-Qun Wang
Author Affiliations +
Proceedings Volume 6423, International Conference on Smart Materials and Nanotechnology in Engineering; 642336 (2007) https://doi.org/10.1117/12.780052
Event: International Conference on Smart Materials and Nanotechnology in Engineering, 2007, Harbin, China
Abstract
Based on the properties of thermoelectric cooler (TEC), a thermal analysis model for the thermo-smart structure of composite with TECs is built. Some parameters which affect the temperature distribution of the structure are designed, such as the location of TECs and the thermal boundary conditions. A temperature control system is designed for the thermo-smart structure and simulated in SIMULINK. The results of simulation indicate that the structure combined with PI controller performs greatly to temperature control. The applications of smart thermal structure on cooling design of computer chips and infrared stealth will benefit from the paper's results.
© (2007) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Zhong-Min Deng, Xian-Li Cheng, and Xiao-Qun Wang "Analysis and design for the thermo-smart structure of composite with TEC", Proc. SPIE 6423, International Conference on Smart Materials and Nanotechnology in Engineering, 642336 (27 November 2007); https://doi.org/10.1117/12.780052
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KEYWORDS
Composites

Thermal modeling

Control systems

Thermoelectric materials

Thermal analysis

Capacitance

Smart structures

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