1 November 2007 Study on mechanical property of PI/SiO2 nano-hybrid film
Author Affiliations +
Proceedings Volume 6423, International Conference on Smart Materials and Nanotechnology in Engineering; 64234V (2007) https://doi.org/10.1117/12.780075
Event: International Conference on Smart Materials and Nanotechnology in Engineering, 2007, Harbin, China
Abstract
Polyimide/Silica (PI/SiO2) nano-hybrid films have been prepared through the Sol-Gel process by mixing various proportions of Methyltriethoxysilane (MTEOS) with polyamic acid (PAA). The fracture morphologies of PI/SiO2 hybrid films were characterized by Scanning Electron Microscope (SEM), and the result showed that silica particles dispersed in PI matrix finely. The sizes of silica particles increased with silica content, and the shapes of silica particle were rod-like. The inorganic phase changed from isolated silica particles to interconnected network with the PI matrix with increasing silica content. The curve of wide-angle X-Ray diffraction (WXRD) confirmed that the introduction of silica destroyed the ordering of PI molecular chains. The mechanical properties of hybrid films were measured by Electron Universal Testing Machine, and the results indicated that the tensile strength and elongation at the break of hybrid films reached to maximum at silica content of 1wt%. Compared with pure PI film, the tensile strength was improved 8wt%, and the elongation at the break of hybrid films was improved 10wt%. The two parameter of hybrid films were equal to pure PI film's at silica content from 1wt% and 5wt%. But, the two parameter decreased with increasing silica content (more than 5wt%).
© (2007) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Mingyan Zhang, Mingyan Zhang, Ying Niu, Ying Niu, Yong Fan, Yong Fan, Tiequan Dong, Tiequan Dong, Shujin Zeng, Shujin Zeng, } "Study on mechanical property of PI/SiO2 nano-hybrid film", Proc. SPIE 6423, International Conference on Smart Materials and Nanotechnology in Engineering, 64234V (1 November 2007); doi: 10.1117/12.780075; https://doi.org/10.1117/12.780075
PROCEEDINGS
6 PAGES


SHARE
Back to Top