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7 February 2007 Robust hard-solder packaging of conduction cooled laser diode bars
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Abstract
We present the reliability of high-power laser diodes utilizing hard solder (AuSn) on a conduction-cooled package (HCCP). We present results of 50 W hard-pulse operation at 8xx nm and demonstrate a reliability of MTTF > 27 khrs (90% CL), which is an order of magnitude improvement over traditional packaging. We also present results at 9xx nm with a reliability of MTTF >17 khrs (90% CL) at 75 W. We discuss finite element analysis (FEA) modeling and time dependent temperature measurements combined with experimental life-test data to quantify true hard-pulse operation. We also discuss FEA and measured stress profiles across laser bars comparing soft and hard solder packaging.
© (2007) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
David Schleuning, Mike Griffin, Philip James, John McNulty, Dan Mendoza, John Morales, David Nabors, Mike Peters, Hailong Zhou, and Murray Reed "Robust hard-solder packaging of conduction cooled laser diode bars", Proc. SPIE 6456, High-Power Diode Laser Technology and Applications V, 645604 (7 February 2007); https://doi.org/10.1117/12.701292
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