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7 February 2007 Highly reliable hard-soldered 1.6kW QCW laser diode stack packaging platform
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We describe the performance and reliability of multi-bar diode stacks assembled with hard solder attachment of the laser diode bar to the conduction-cooled package substrate. The primary stack package design is based on a modular platform that makes use of common piece parts to incorporate anywhere from 2-7 bars, operating at peak powers of 80W/bar to 200W/bar. In assembling monolithic type diode stack packages, it is typical to use a soft solder material such as indium for P-side bar attachment into the package. Due to its low melting point and low yield stress, indium can provide a solder joint that transfers low stress to the laser bar. However, during CW and QCW operation, indium is prone to migration that can cause device failure due to a number of well-known mechanisms. This shortcoming of soft-solder bar attachment can limit the number of shots the stack delivers over its operating life. By replacing the soft solder typically used for P-side attachment with a hard solder, it is possible to greatly reduce or eliminate certain failure modes, thereby increasing the operating life of the part. We demonstrate lifetime of > 1E9 shots at 80 W/bar, 250 us/40 Hz pulses, and 50C package operating temperature.
© (2007) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Paul Rosenberg, Patrick Reichert, Jihua Du, Michael Fouksman, Hailong Zhou, John McNulty, Sherry Tolman, and Calvin Luong "Highly reliable hard-soldered 1.6kW QCW laser diode stack packaging platform", Proc. SPIE 6456, High-Power Diode Laser Technology and Applications V, 645618 (7 February 2007); doi: 10.1117/12.701303;

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