Micro-channel heatsink assemblies made from bonding multi-layered etched metal sheets are commercially available
and are often used for removing the high waste heat loads generated by the operation of diode-laser bars. Typically, a
diode-laser bar is bonded onto a micro-channel (also known as mini-channel) heatsink then stacked in an array to create
compact high power diode-laser sources for a multitude of applications. Under normal operation, the diode-laser waste
heat is removed by passing coolant (typically de-ionized water) through the channels of the heatsink. Because of this,
the heatsink internal structure, including path length and overall channel size, is dictated by the liquid coolant properties.
Due to the material characteristics of these conductive heatsinks, and the necessary electrically serial stacking geometry,
there are several restrictions imparted on the coolant liquid to maintain performance and lifetime. Such systems require
carefully monitored and conductive limited de-ionized water, as well as require stable pH levels, and suitable particle
filtration. These required coolant systems are either stand alone, or heat exchangers are typically costly and heavy
restricting certain applications where minimal weight to power ratios are desired.
In this paper, we will baseline the existing water cooled Spectra-Physics MonsoonTM heatsink technology utilizing
compressed air, and demonstrate a novel modular stackable heatsink concept for use with gaseous fluids that, in some
applications may replace the existing commercially available water-cooled heatsink technology. We will explain the
various benefits of utilizing air while maintaining mechanical form factors and packing densities. We will also show
thermal-fluid modeling results and predictions as well as operational performance curves for efficiency and power and
compare these data to the existing commercially available technology.