20 March 2007 Hybrid micro-optical system integration by laserbeam soldering
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Longterm stable and high precise interconnections between small optical components and the optomechanical platform are mandatory for the assembly of complex and miniaturized optoelectronical systems. The approach discussed in this paper is to integrate optics and electronics on a common platform that is a ceramic Printed Circuit Board with embedded mounting structures for easy passive alignment of the optical components. Active alignment with higher accuracy can also be used, in both cases laserbeam soldering is the preferred and precise joining technology. Thin solder layers as well as solder bumps are used to create joints with an accuracy <±0.5 &mgr;m, suitable for singlemode coupling applications.
© (2007) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Erik Beckert, Erik Beckert, Ramona Eberhardt, Ramona Eberhardt, Henrik Banse, Henrik Banse, Andreas Tünnermann, Andreas Tünnermann, Frank Buchmann, Frank Buchmann, Matthias Fettke, Matthias Fettke, } "Hybrid micro-optical system integration by laserbeam soldering", Proc. SPIE 6459, Laser-based Micro- and Nanopackaging and Assembly, 645904 (20 March 2007); doi: 10.1117/12.699882; https://doi.org/10.1117/12.699882

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