20 March 2007 Processing benefits of high repetition rate and high average power 355 nm laser for micromachining of microelectronics packaging materials
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Abstract
It has been shown that micromachining of polyimide using a mode-locked high repetition rate, 80 MHz, 355nm laser is more efficient than the q-switched laser at same wavelength and same power level in terms of material removal rate. In this study we have explored and characterized the benefits of using high repetition rate, high average power, 355 nm mode-locked and q-switched lasers for micromachining of various microelectronics packaging materials that have different thermal properties. The removal rate and quality of machining have been analyzed against the difference in thermal properties of the material. The implications of the results observed are also discussed from practical manufacturing perspective.
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Rajesh S. Patel, Rajesh S. Patel, James Bovatsek, James Bovatsek, } "Processing benefits of high repetition rate and high average power 355 nm laser for micromachining of microelectronics packaging materials", Proc. SPIE 6459, Laser-based Micro- and Nanopackaging and Assembly, 64590H (20 March 2007); doi: 10.1117/12.705589; https://doi.org/10.1117/12.705589
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