Paper
7 March 2007 Nanoscale pattern transfer for templates, NEMS, and nano-optics
Deirdre L. Olynick, J. Alexander Liddle, Bruce D. Harteneck, Stefano Cabrini, Ivo W. Rangelow
Author Affiliations +
Abstract
Plasma etching is an enabling technology in nano optic, nanoelectronic devices, nano electro mechanical systems (NEMS) and nanoresolution templates for nano imprint lithography (NIL). With shrinkage, one must overcome significant challenges to meet the stringent profile and CD goals necessary for nanoscale applications. Using the example of Si nanoimprint template fabrication, we show how ion/sidewall/mask interactions can dominate feature profile evolution at the nanoscale and what to look for successful pattern transfer. Gas chopping or multiplexed etching, generally used for deep silicon etching, is often avoided at the nanoscale due to unacceptable undercut and sidewall scalloping. We demonstrate a multiplexed etching process in silicon with sub-5 nm amplitude scallops which is well suited for NEMS and nano optics applications and which reduces the deleterious role of ion/sidewall/mask interactions at the nanoscale.
© (2007) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Deirdre L. Olynick, J. Alexander Liddle, Bruce D. Harteneck, Stefano Cabrini, and Ivo W. Rangelow "Nanoscale pattern transfer for templates, NEMS, and nano-optics", Proc. SPIE 6462, Micromachining Technology for Micro-Optics and Nano-Optics V and Microfabrication Process Technology XII, 64620J (7 March 2007); https://doi.org/10.1117/12.705033
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CITATIONS
Cited by 9 scholarly publications.
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KEYWORDS
Etching

Silicon

Ions

Nanoimprint lithography

Chemistry

Nano optics

Nanoelectromechanical systems

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