19 January 2007 Hybrid approach to MEMS reliability assessment
Author Affiliations +
Abstract
Recent advances in MEMS technology have led to development of a multitude of new devices. However applications of these devices are hampered by challenges posed by limited understanding of their reliability particularly the impacts of long-term storage. Current trend in micro/nanosystems is to produce ever smaller, lighter, and more capable devices in greater quantities and at a lower cost than ever before. In addition, the finished products have to operate at very low power and in very adverse conditions while assuring durable and reliable performance. Some of the new devices are being developed to function at high operational speeds, others to make accurate measurements of operating conditions in specific processes. Regardless of their application, the devices have to be reliable while in use. MEMS reliability, however, is application specific and, usually, has to be developed on a case by case basis. This paper presents a hybrid approach/methodology particularly suitable to quantitative studies of various aspects in MEMS reliability assessment. The presentation is illustrated with selected examples representing an initial study of reliability of specific MEMS. By quantitatively characterizing performance of MEMS, under different operating conditions, we can make specific suggestions for their improvements. Then, using the hybrid approach/methodology, we can verify the effect of these improvements. In this way, we can develop better understanding of functional characteristics of MEMS sensors, which will ensure that these sensors are operated at maximum performance, are durable, and are reliable.
© (2007) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
James L. Zunino, Donald R. Skelton, Wei Han, Ryszard J. Pryputniewicz, "Hybrid approach to MEMS reliability assessment", Proc. SPIE 6463, Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS VI, 646304 (19 January 2007); doi: 10.1117/12.700697; https://doi.org/10.1117/12.700697
PROCEEDINGS
12 PAGES


SHARE
KEYWORDS
Microelectromechanical systems

Reliability

Switches

Sensors

Packaging

Optoelectronics

CCD cameras

RELATED CONTENT


Back to Top