19 January 2007 Effects of V additions on the mechanical behavior of Au thin films for MEMS contact switches
Author Affiliations +
Abstract
Au, Au-V solid solution, and Au-V2O5 dispersion films were fabricated for comparison of electrical and mechanical characteristics. Resistivity and nanoindentation hardness increased with increasing V content in all films, but the ratio of resistivity increase to hardness increase was much lower for the Au-V2O5 films. Measurements of contact force and electrical contact resistance between pairs of Au or Au-V films show that increased hardness and resistivity in the alloy films results in higher contact resistance and less adhesion than in pure Au. These results imply that the Au-V2O5 films may exhibit attractive behavior when used in a contact configuration, but this has not yet been tested.
© (2007) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
T. Bannuru, S. Narksitipan, W. L. Brown, R. P. Vinci, "Effects of V additions on the mechanical behavior of Au thin films for MEMS contact switches", Proc. SPIE 6463, Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS VI, 646306 (19 January 2007); doi: 10.1117/12.700834; https://doi.org/10.1117/12.700834
PROCEEDINGS
6 PAGES


SHARE
RELATED CONTENT

Analysis of metal-metal contacts in RF MEMS switches
Proceedings of SPIE (March 09 2013)
Design techniques for surface-micromachining MEMS processes
Proceedings of SPIE (September 19 1995)
CMOS-compatible RF MEMS switch
Proceedings of SPIE (August 16 2004)
Capacitive rf MEMS switch with composite beam
Proceedings of SPIE (September 10 2002)

Back to Top