19 January 2007 Process engineering and failure analysis of MEMS and MOEMS by digital holography microscopy (DHM)
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Process engineering and failure analysis of MEMS and MOEMS require static and dynamical characterization of both their in-plane and out of plane response to an excitation. A remarkable characteristic of Digital Holography Microscopes (DHM) is the extremely short acquisition time required to grab the whole information necessary to provide 3D optical topography of the sample: a unique frame grab, without any vertical or lateral scan provides the information over the full field of view. First, it ensures DHM measurements to be insensitive to vibrations. Second, it opens the door to fast dynamical characterization of micro-systems. For periodic movement analysis, DHM can operate in stroboscopic mode with standard cameras. It enables precise characterization up to excitation frequencies of 100 kHz with recovery cycle of 10% simply by triggering properly the camera. Pulsed sources can be used for investigation of higher excitation frequencies. For non periodic movement analysis fast acquisition cameras and postponed treatment are used. DHM are therefore unique and very efficient tool for dynamical characterization of in-plane and out-of-plane response. In this paper we show the basics of the technology and illustrate process engineering and failure analysis using DHM with an example of in and out of plane characterization of movements of a variable capacitor using the stroboscopic mode of acquisition.
© (2007) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Frédéric Montfort, Frédéric Montfort, Yves Emery, Yves Emery, François Marquet, François Marquet, Etienne Cuche, Etienne Cuche, Nicolas Aspert, Nicolas Aspert, Eduardo Solanas, Eduardo Solanas, Alexandre Mehdaoui, Alexandre Mehdaoui, Adrian Ionescu, Adrian Ionescu, Christian Depeursinge, Christian Depeursinge, } "Process engineering and failure analysis of MEMS and MOEMS by digital holography microscopy (DHM)", Proc. SPIE 6463, Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS VI, 64630G (19 January 2007); doi: 10.1117/12.699837; https://doi.org/10.1117/12.699837

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