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6 February 2007 3-D microoptic systems integration: advances in fabrication and packaging
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Abstract
The use of the third spatial dimension in optical systems is of interest for many applications such as sensing and data communications. Furthermore, the need for small size and low cost requires suitable concepts for integration and packaging. Here, free-space optical integration based on a planarized configuration is described. Recent advances are shown in the fabrication of the elements using grey-scale lithography and micromachining. Systems demonstrations will be presented for the field of optical interconnection.
© (2007) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
J. Jahns, M. Bohling, M. Jarczynski, and Th. Seiler "3-D microoptic systems integration: advances in fabrication and packaging", Proc. SPIE 6478, Photonics Packaging, Integration, and Interconnects VII, 64780D (6 February 2007); https://doi.org/10.1117/12.714299
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