High speed IC design trends and optoelectronic packaging: a perspective on cost reduction

Badri N. Gomatam

doi:10.1117/12.714298

9 February 2007 High speed IC design trends and optoelectronic packaging: a perspective on cost reduction

Badri N. Gomatam

Proceedings Volume 6478, Photonics Packaging, Integration, and Interconnects VII; 64780H (2007) https://doi.org/10.1117/12.714298
Event: Integrated Optoelectronic Devices 2007, 2007, San Jose, California, United States

Abstract

Recent developments in IC design technology for high-speed communications have led to highly improved optoelectronic (O/E) system design. Specifically, signal integrity management is a specific area of communications circuit design that is promising in playing a role in optoelectronic packaging and component cost. This paper explores the potential of these techniques in impacting O/E component design and possibilities for cost reduction. It is argued that a judicious tradeoff in system parameters such as link length and component bandwidth could impact overall cost significantly.

Citation Download Citation

Badri N. Gomatam "High speed IC design trends and optoelectronic packaging: a perspective on cost reduction", Proc. SPIE 6478, Photonics Packaging, Integration, and Interconnects VII, 64780H (9 February 2007); https://doi.org/10.1117/12.714298

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