9 February 2007 High speed IC design trends and optoelectronic packaging: a perspective on cost reduction
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Abstract
Recent developments in IC design technology for high-speed communications have led to highly improved optoelectronic (O/E) system design. Specifically, signal integrity management is a specific area of communications circuit design that is promising in playing a role in optoelectronic packaging and component cost. This paper explores the potential of these techniques in impacting O/E component design and possibilities for cost reduction. It is argued that a judicious tradeoff in system parameters such as link length and component bandwidth could impact overall cost significantly.
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Badri N. Gomatam, Badri N. Gomatam, } "High speed IC design trends and optoelectronic packaging: a perspective on cost reduction", Proc. SPIE 6478, Photonics Packaging, Integration, and Interconnects VII, 64780H (9 February 2007); doi: 10.1117/12.714298; https://doi.org/10.1117/12.714298
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