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20 February 2007 MEMS digital camera
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Proceedings Volume 6502, Digital Photography III; 65020K (2007)
Event: Electronic Imaging 2007, 2007, San Jose, CA, United States
MEMS technology uses photolithography and etching of silicon wafers to enable mechanical structures with less than 1 &mgr;m tolerance, important for the miniaturization of imaging systems. In this paper, we present the first silicon MEMS digital auto-focus camera for use in cell phones with a focus range of 10 cm to infinity. At the heart of the new silicon MEMS digital camera, a simple and low-cost electromagnetic actuator impels a silicon MEMS motion control stage on which a lens is mounted. The silicon stage ensures precise alignment of the lens with respect to the imager, and enables precision motion of the lens over a range of 300 &mgr;m with < 5 &mgr;m hysteresis and < 2 &mgr;m repeatability. Settling time is < 15 ms for 200 &mgr;m step, and < 5ms for 20 &mgr;m step enabling AF within 0.36 sec at 30 fps. The precise motion allows COTS optics to maintain MTF > 0.8 at 20 cy/mm up to 80% field over the full range of motion. Accelerated lifetime testing has shown that the alignment and precision of motion is maintained after 8,000 g shocks, thermal cycling from - 40 C to 85 C, and operation over 20 million cycles.
© (2007) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
R. C. Gutierrez, T. K. Tang, R. Calvet, and E. R. Fossum "MEMS digital camera", Proc. SPIE 6502, Digital Photography III, 65020K (20 February 2007);


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