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15 March 2007 Demolding strategy to improve the hot embossing throughput
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Hot embossing throughput is a key issue, which has been addressed in this paper. We show how it is possible to remove the mold from the imprinted resist at the imprint temperature. We study reflow behavior of imprinted patterns, and make a cooling and quenching simulation. This work can lead to design of cooling tools adapted to a given application, and suits as well for the full wafer imprint, as well for the roll imprint.
© (2007) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Tanguy Leveder, Stefan Landis, Laurent Davoust, Sebastien Soulan, and Nicolas Chaix "Demolding strategy to improve the hot embossing throughput", Proc. SPIE 6517, Emerging Lithographic Technologies XI, 65170N (15 March 2007);

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