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15 March 2007 Status and path to a final EUVL reticle-handling solution
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Abstract
In extreme ultraviolet lithography (EUVL), the lack of a suitable material to build conventional pellicles calls for industry standardization of new techniques for protection and handling throughout the reticle's lifetime. This includes reticle shipping, robotic handling, in-fab transport, storage, and uses in atmospheric environments for metrology and vacuum environments for EUV exposure. In this paper, we review the status of the industry-wide progress in developing EUVL reticle-handling solutions. We show the industry's leading reticle carrier approaches for particle-free protection, such as improvements in conventional single carrier designs and new EUVL-specific carrier concepts, including variations on a removable pellicle. Our test indicates dual pod approach of the removable pellicle led to nearly particle-free use during a simulated life cycle, at ~50nm inspection sensitivity. We will provide an assessment of the remaining technical challenges facing EUVL reticle-handling technology. Finally, we will review the progress of the SEMI EUVL Reticle-handling Task Force in its efforts to standardize a final EUV reticle protection and handling solution.
© (2007) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Long He, Kevin Orvek, Phil Seidel, Stefan Wurm, Jon Underwood, and Ernie Betancourt "Status and path to a final EUVL reticle-handling solution", Proc. SPIE 6517, Emerging Lithographic Technologies XI, 65171O (15 March 2007); https://doi.org/10.1117/12.712872
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