16 March 2007 CD budget analysis on hole pattern in EUVL
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Abstract
In this paper we focus exclusively on hole process. The motivation here is to investigate on the performance of EUVL for hole patterning in relation to contributions from mask, exposure tool, and resist process. In this paper we investigated the patterning characteristics of arrayed, staggered, and isolated holes including features showing trench patterns.
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Nobuyuki Iriki, Hajime Aoyama, Toshihiko Tanaka, "CD budget analysis on hole pattern in EUVL", Proc. SPIE 6517, Emerging Lithographic Technologies XI, 65172K (16 March 2007); doi: 10.1117/12.711288; https://doi.org/10.1117/12.711288
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