Scatterometry on pelliclized masks: an option for wafer fabs

Emily Gallagher; Craig Benson; Masaru Higuchi; Yasuhiro Okumoto; Michael Kwon; Sanjay Yedur; Shifang Li; Sangbong Lee; Milad Tabet

doi:10.1117/12.714997

5 April 2007 Scatterometry on pelliclized masks: an option for wafer fabs

Emily Gallagher, Craig Benson, Masaru Higuchi, Yasuhiro Okumoto, Michael Kwon, Sanjay Yedur, Shifang Li, Sangbong Lee, Milad Tabet

Author Affiliations +

Proceedings Volume 6518, Metrology, Inspection, and Process Control for Microlithography XXI; 65181T (2007) https://doi.org/10.1117/12.714997
Event: SPIE Advanced Lithography, 2007, San Jose, California, United States

Abstract

Optical scatterometry-based metrology is now widely used in wafer fabs for lithography, etch, and CMP applications. This acceptance of a new metrology method occurred despite the abundance of wellestablished CD-SEM and AFM methods. It was driven by the desire to make measurements faster and with a lower cost of ownership. Over the last year, scatterometry has also been introduced in advanced mask shops for mask measurements. Binary and phase shift masks have been successfully measured at all desired points during photomask production before the pellicle is mounted. There is a significant benefit to measuring masks with the pellicle in place. From the wafer fab's perspective, through-pellicle metrology would verify mask effects on the same features that are characterized on wafer. On-site mask verification would enable quality control and trouble-shooting without returning the mask to a mask house. Another potential application is monitoring changes to mask films once the mask has been delivered to the fab (haze, oxide growth, etc.). Similar opportunities apply to the mask metrologist receiving line returns from a wafer fab. The ability to make line-return measurements without risking defect introduction is clearly attractive. This paper will evaluate the feasibility of collecting scatterometry data on pelliclized masks. We explore the effects of several different pellicle types on scatterometry measurements made with broadband light in the range of 320-780 nm. The complexity introduced by the pellicles' optical behavior will be studied.

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Emily Gallagher, Craig Benson, Masaru Higuchi, Yasuhiro Okumoto, Michael Kwon, Sanjay Yedur, Shifang Li, Sangbong Lee, and Milad Tabet "Scatterometry on pelliclized masks: an option for wafer fabs", Proc. SPIE 6518, Metrology, Inspection, and Process Control for Microlithography XXI, 65181T (5 April 2007); https://doi.org/10.1117/12.714997

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