5 April 2007 High-throughput polarization imaging for defocus and dose inspection for production wafers
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Advances in lithography create a unique challenge for process window control with defects inspection tools. As the technology moves towards smaller line widths and more complicated structures, the sensitivity requirements for some process defects become higher, such as defocus and dose defects at 50nm or lower technology nodes. Currently automated macro inspection tools are used to detect a wide range of macro defects in the litho area, such as coating defects, particles, scratches, as well as the process defects. Most tools, however, cannot satisfy the new sensitivity requirements for the process defects while maintaining their current inspection capability for other defects. Rudolph Technologies approaches this challenge by integrating a unique polarization-imaging configuration, which enhances detection of defocus and dose defects without sacrificing the existing capability to detect other types of macro defects. The improved inspection system has demonstrated high sensitivity for defocus and dose defects on production wafers at multiple process nodes at high throughput.
© (2007) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Gang Sun, Gang Sun, Eugene Onoichenco, Eugene Onoichenco, Yonghuang Fu, Yonghuang Fu, Yongqiang Liu, Yongqiang Liu, Ricardo Amell, Ricardo Amell, Casey McCandless, Casey McCandless, Rajasekar Reddy, Rajasekar Reddy, Gidesh Kumar, Gidesh Kumar, Max Guest, Max Guest, } "High-throughput polarization imaging for defocus and dose inspection for production wafers", Proc. SPIE 6518, Metrology, Inspection, and Process Control for Microlithography XXI, 65182M (5 April 2007); doi: 10.1117/12.712381; https://doi.org/10.1117/12.712381

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