Translator Disclaimer
5 April 2007 Say good-bye to DOF: statistical process window analysis with inline lithographic process variations
Author Affiliations +
Abstract
In this paper we present one application of our new Advanced Lithography Parameters Extraction (ALPE) system in the lithography process window analysis. Compared with traditional DOF/EL based process window analysis or Monte Carlo approaches with pre-assumed process variations, our new approach uses real-life process variations (exposure, focus, and even PEB temperature, etc. if needed) collected by the new ALPE system. Different from pre-assumed process variations and independently measured process variations, all these process variations are directly correlated with inline CD variations, so we call them real-life process variations. Based on these real-life process variations, the estimation of final CD uniformity will be more accurate and objective. Comparing estimated CD uniformity of new process with CD uniformity of baseline process, it is possible for us to tell which process is better from statistical point of view.
© (2007) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Wenzhan Zhou, Minghao Tang, Huipeng Koh, and Meisheng Zhou "Say good-bye to DOF: statistical process window analysis with inline lithographic process variations", Proc. SPIE 6518, Metrology, Inspection, and Process Control for Microlithography XXI, 651832 (5 April 2007); https://doi.org/10.1117/12.702276
PROCEEDINGS
8 PAGES


SHARE
Advertisement
Advertisement
Back to Top