Paper
30 March 2007 Optimization of material and process parameter for minimizing defect in implementation of MFHM process
Kilyoung Lee, Junggun Heo, Keundo Ban, Hyungsuk Seo, Geunsu Lee, Wonkyu Kim, Junhee Cho, Junhyeub Sun, Sungkwon Lee, Cheolkyu Bok, Seungchan Moon, Jinwoong Kim
Author Affiliations +
Abstract
Silicon-containing material has recently attracted attention as new hard mask material. We have studied the applicability of MFHM (Multi-Functional Hard Mask)/SOC (Spin on Carbon) materials as an alternative to the BARC/SiON/ amorphous carbon (a-C) process. This process is very useful in terms of cost reduction and process simplicity compared to a-C process. Evaluation results have showed good lithographic and etch performances. However, this MFHM process has showed specific defects related to material. This paper will focus on defect type and suggest its solution.
© (2007) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Kilyoung Lee, Junggun Heo, Keundo Ban, Hyungsuk Seo, Geunsu Lee, Wonkyu Kim, Junhee Cho, Junhyeub Sun, Sungkwon Lee, Cheolkyu Bok, Seungchan Moon, and Jinwoong Kim "Optimization of material and process parameter for minimizing defect in implementation of MFHM process", Proc. SPIE 6519, Advances in Resist Materials and Processing Technology XXIV, 65192Y (30 March 2007); https://doi.org/10.1117/12.712406
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KEYWORDS
Etching

System on a chip

Silicon

Coating

Lithography

Carbon

Materials processing

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