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2 April 2007 Reducing bubbles and particles associated with photoresist packaging materials and dispense systems
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Abstract
A review of bubble energetics is presented to provide background into gas saturation and bubble formation in semiconductor resists. Nitrogen was used as a drive gas to push liquid out of several package materials versus a mechanical pump. The incorporation of dissolved gas was measured and a barrier liner was found to be superior versus a bottle with no liner. We have demonstrated that a pressure dispense package with an appropriate barrier liner provides a means to deliver lithographic chemicals and resist without the use of a mechanical pump.
© (2007) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
W. B. Alexander, K. T. O'Dougherty, W. Liu, H. Yan, and K. Mikkelsen "Reducing bubbles and particles associated with photoresist packaging materials and dispense systems", Proc. SPIE 6519, Advances in Resist Materials and Processing Technology XXIV, 651939 (2 April 2007); https://doi.org/10.1117/12.712419
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