21 March 2007 Coupling-aware mixed dummy metal insertion for lithography
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Proceedings Volume 6521, Design for Manufacturability through Design-Process Integration; 65210H (2007); doi: 10.1117/12.711644
Event: SPIE Advanced Lithography, 2007, San Jose, California, United States
Abstract
As integrated circuits manufacturing technology is advancing into 65nm and 45nm nodes, extensive resolution enhancement techniques (RET) are needed to correctly manufacture a chip design. The widely used RET called offaxis illumination (OAI) introduces forbidden pitches which lead to very complex design rules. It has been observed that imposing uniformity on layout designs can substantially improve printability under OAI. In this paper, two types of assist features for the metal layer are proposed to improve the uniformity, printable assist feature and segmented printable assist feature. They bring different costs on performance and manufacturing. Coupling and lithography costs from these assist features are discussed. Optimal insertion algorithm is proposed to use both types of dummy metals, considering trade-offs between coupling and lithography costs.
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Liang Deng, Martin D. F. Wong, Kai-Yuan Chao, Hua Xiang, "Coupling-aware mixed dummy metal insertion for lithography", Proc. SPIE 6521, Design for Manufacturability through Design-Process Integration, 65210H (21 March 2007); doi: 10.1117/12.711644; https://doi.org/10.1117/12.711644
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KEYWORDS
Metals

Capacitance

Lithography

Optical proximity correction

Resolution enhancement technologies

Photomasks

SRAF

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