Translator Disclaimer
21 March 2007 Coupling-aware mixed dummy metal insertion for lithography
Author Affiliations +
As integrated circuits manufacturing technology is advancing into 65nm and 45nm nodes, extensive resolution enhancement techniques (RET) are needed to correctly manufacture a chip design. The widely used RET called offaxis illumination (OAI) introduces forbidden pitches which lead to very complex design rules. It has been observed that imposing uniformity on layout designs can substantially improve printability under OAI. In this paper, two types of assist features for the metal layer are proposed to improve the uniformity, printable assist feature and segmented printable assist feature. They bring different costs on performance and manufacturing. Coupling and lithography costs from these assist features are discussed. Optimal insertion algorithm is proposed to use both types of dummy metals, considering trade-offs between coupling and lithography costs.
© (2007) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Liang Deng, Martin D. F. Wong, Kai-Yuan Chao, and Hua Xiang "Coupling-aware mixed dummy metal insertion for lithography", Proc. SPIE 6521, Design for Manufacturability through Design-Process Integration, 65210H (21 March 2007);


OPC verification considering CMP induced topography
Proceedings of SPIE (September 03 2015)
Improvements of AIMS D2DB matching for product patterns
Proceedings of SPIE (July 08 2015)
The rising cost and complexity of RETs
Proceedings of SPIE (May 02 2004)
Reducing shot count through optimization-based fracture
Proceedings of SPIE (October 13 2011)
MEEF-based mask inspection
Proceedings of SPIE (December 05 2004)

Back to Top