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21 March 2007 Automatic OPC mask shape repair
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Virtual manufacturing, enabled by rapid, full-chip simulation is a critical component of the mask tapeout flow in the low-k1 lithography era. Virtual manufacturing enables first-time-right silicon manufacturing by detecting printing failures before a costly and time-consuming mask tapeout and wafer print has occurred. This is especially true in the latest tapeout flows which include Optical Proximity Correction (OPC) and various Resolution Enhancement Technologies (RET). One issue arising with the addition of virtual manufacturing to the mask tapeout flow is the proper user response to any detected failures. The authors will present one vision for OPC mask shape defect handling which can be completely integrated within the user's existing flow, and most importantly, requires no human intervention to disposition, waive, and/or repair detected mask shape defects.
© (2007) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
James Word, Dragos Dudau, and Nick Cobb "Automatic OPC mask shape repair", Proc. SPIE 6521, Design for Manufacturability through Design-Process Integration, 65211G (21 March 2007);


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