3 May 2007 Challenges of residual layer minimisation in thermal nanoimprint lithography
Author Affiliations +
Proceedings Volume 6533, 23rd European Mask and Lithography Conference; 65330Q (2007) https://doi.org/10.1117/12.736926
Event: European Mask and Lithography Conference2007, 2007, Grenoble, France
When minimal residual layers are aimed at in the field of thermal imprint lithography (T-NIL) 'partial cavity filling' offers a promising method to succeed. There, a filling of any of the cavities a stamp provides is avoided by a reduction of the initial layer thickness. Due to this unusual procedure, some challenges evolve during the imprint of complex types of structures. We report about effects that go along with partial cavity filling like physical self assembly and recovery. Furthermore we will give some suggestions how they may be reduced or even can be avoided.
© (2007) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Nicolas Bogdanski, Nicolas Bogdanski, Matthias Wissen, Matthias Wissen, Saskia Möllenbeck, Saskia Möllenbeck, Hella-Christin Scheer, Hella-Christin Scheer, } "Challenges of residual layer minimisation in thermal nanoimprint lithography", Proc. SPIE 6533, 23rd European Mask and Lithography Conference, 65330Q (3 May 2007); doi: 10.1117/12.736926; https://doi.org/10.1117/12.736926

Back to Top