Thermal profiling techniques for electronics inspection

Sheng-Jen Hsieh

doi:10.1117/12.720506

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9 April 2007 Thermal profiling techniques for electronics inspection

Sheng-Jen Hsieh

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Proceedings Volume 6541, Thermosense XXIX; 65410G (2007) https://doi.org/10.1117/12.720506
Event: Defense and Security Symposium, 2007, Orlando, Florida, United States

Abstract

This paper reviews applications of infrared thermal profiling techniques to detection of faults and defects in electronics. Issues essential to the successful application of infrared techniques to electronics manufacturing and circuit card maintenance are investigated. These issues include basic know-how such as scanning time interval and screening variables; a description of the types of defects and faults these methods have been used to detect; and a comparison of infrared thermal imaging and other detection means such as X-ray and functional testers. Future directions include design for infrared diagnosis and development of integrated testing technique for detection and root-cause analysis and development of hybrid analysis techniques, such as combining genetic algorithms and neural network techniques for thermal profile pattern recognition.

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Sheng-Jen Hsieh "Thermal profiling techniques for electronics inspection", Proc. SPIE 6541, Thermosense XXIX, 65410G (9 April 2007); https://doi.org/10.1117/12.720506

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