Translator Disclaimer
9 April 2007 Development of thermal response spectroscopy technique for determination of defect parameters
Author Affiliations +
Abstract
Thermal response spectroscopy method was newly developed for quantitative measurement of size and depth of the defects. In this method, sequential thermal response data observed on the surface of objective body under active step heating were processed by lock-in analysis scheme based on the Fourier series expansion, in which Fourier coefficients synchronizing with sine and cosine waves were calculated. Phase and amplitude were calculated using these coefficients for different thermal fluctuation periods and different defect parameters, such as size and depth of the defects. Obtained phase and amplitude were represented in spectroscopic diagram. It was found that plotted phase and amplitude data of certain defect depth obtained for various thermal fluctuation periods showed characteristic curves in the diagram. An inverse analysis method for the thermal response spectroscopy was proposed for quantitative measurement of size and depth of the defects. The least-squares residual inverse analysis scheme was applied to the defect parameter determination based on the Fourier coefficient values in the spectroscopic diagram. It was found that defect depth and size can be quantitatively determined by the inverse analyses.
© (2007) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Takahide Sakagami, Daisuke Imanishi, and Shiro Kubo "Development of thermal response spectroscopy technique for determination of defect parameters", Proc. SPIE 6541, Thermosense XXIX, 65410T (9 April 2007); https://doi.org/10.1117/12.716438
PROCEEDINGS
7 PAGES


SHARE
Advertisement
Advertisement
Back to Top