14 May 2007 Signal processing core for high performance thermal imaging
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Abstract
In order to fully exploit emerging 3rd generation infrared detector technology, very high performance signal processing electronics are required in order to process in real-time, the vast amount of data that can be generated. This paper describes SELEX Sensors and Airborne System's most recent developments based upon the existing Sensor Integrated Modular Architecture (SiGMA) thermal imager. The key advances described in this paper include a modular architecture approach allowing physical separation of the processing core from the detector and proximity electronics, the miniaturisation of the processing electronics and the introduction of a solid state micro-scan mechanism which builds upon concepts developed during the company's previous work with uncooled infrared detector technology. The sensor architecture is initially designed to operate with the SELEX S&AS developed Hawk infrared detector, a medium waveband 640*512 element CMT array on a 16 micron pitch, but will also be compatible with the emerging Albion detector arrays, a medium waveband 1024*768 element CMT array on a 16 micron pitch and a long waveband 640*512 element CMT array on a 24 micron pitch. Other areas described are the development of advanced image processing algorithms including non-linear correction for display optimisation.
© (2007) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
M. Lawrence, M. Lawrence, S. F. Ashley, S. F. Ashley, M. Lupton, M. Lupton, R. K. McEwen, R. K. McEwen, M. Wilson, M. Wilson, } "Signal processing core for high performance thermal imaging", Proc. SPIE 6542, Infrared Technology and Applications XXXIII, 654215 (14 May 2007); doi: 10.1117/12.718912; https://doi.org/10.1117/12.718912
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