This paper reviews specifications and performances of a 160 x 120 uncooled infrared focal plane array made from
amorphous silicon micro bolometer with a pixel-pitch of 25 μm, integrated in a LCC package and mass production
This new 25 μm pixel design benefits from a higher pixel thermal insulation while keeping low thermal time constant.
Furthermore, we developed this new 25 μm version on the basis of the well mastered 35 μm pixel-pitch technology.
Thanks to this new pixel design and by pushing the design rules even further, a high fill factor has been kept, without the
use of a complex, as well as an expensive, two-level structure.
The detector is described in terms of readout integrated circuit (ROIC) architecture, packaging, operability and electro-optical
A new read out integrated circuit structure has been designed specifically for this detector. High level functions like gain,
image flip and integration time could be operated through a serial link to minimize the number of electrical
In addition, a small LCC package has been developed enabling mass production dedicated to compact hand held or
helmet mounted cameras.