14 May 2007 Uncooled amorphous silicon 160 x 120 IRFPA with 25-μm pixel-pitch for large volume applications
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Abstract
This paper reviews specifications and performances of a 160 x 120 uncooled infrared focal plane array made from amorphous silicon micro bolometer with a pixel-pitch of 25 μm, integrated in a LCC package and mass production oriented. This new 25 μm pixel design benefits from a higher pixel thermal insulation while keeping low thermal time constant. Furthermore, we developed this new 25 μm version on the basis of the well mastered 35 μm pixel-pitch technology. Thanks to this new pixel design and by pushing the design rules even further, a high fill factor has been kept, without the use of a complex, as well as an expensive, two-level structure. The detector is described in terms of readout integrated circuit (ROIC) architecture, packaging, operability and electro-optical performances. A new read out integrated circuit structure has been designed specifically for this detector. High level functions like gain, image flip and integration time could be operated through a serial link to minimize the number of electrical interconnections. In addition, a small LCC package has been developed enabling mass production dedicated to compact hand held or helmet mounted cameras.
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C. Trouilleau, C. Trouilleau, B. Fieque, B. Fieque, J. L. Tissot, J. L. Tissot, P. Robert, P. Robert, A. Crastes, A. Crastes, C. Minassian, C. Minassian, O. Legras, O. Legras, B. Dupont, B. Dupont, A. Touvignon, A. Touvignon, S. Tinnes, S. Tinnes, J. J. Yon, J. J. Yon, A. Arnaud, A. Arnaud, } "Uncooled amorphous silicon 160 x 120 IRFPA with 25-μm pixel-pitch for large volume applications", Proc. SPIE 6542, Infrared Technology and Applications XXXIII, 65421V (14 May 2007); doi: 10.1117/12.723599; https://doi.org/10.1117/12.723599
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