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14 May 2007 Uncooled amorphous silicon 160 x 120 IRFPA with 25-μm pixel-pitch for large volume applications
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This paper reviews specifications and performances of a 160 x 120 uncooled infrared focal plane array made from amorphous silicon micro bolometer with a pixel-pitch of 25 μm, integrated in a LCC package and mass production oriented. This new 25 μm pixel design benefits from a higher pixel thermal insulation while keeping low thermal time constant. Furthermore, we developed this new 25 μm version on the basis of the well mastered 35 μm pixel-pitch technology. Thanks to this new pixel design and by pushing the design rules even further, a high fill factor has been kept, without the use of a complex, as well as an expensive, two-level structure. The detector is described in terms of readout integrated circuit (ROIC) architecture, packaging, operability and electro-optical performances. A new read out integrated circuit structure has been designed specifically for this detector. High level functions like gain, image flip and integration time could be operated through a serial link to minimize the number of electrical interconnections. In addition, a small LCC package has been developed enabling mass production dedicated to compact hand held or helmet mounted cameras.
© (2007) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
C. Trouilleau, B. Fieque, J. L. Tissot, P. Robert, A. Crastes, C. Minassian, O. Legras, B. Dupont, A. Touvignon, S. Tinnes, J. J. Yon, and A. Arnaud "Uncooled amorphous silicon 160 x 120 IRFPA with 25-μm pixel-pitch for large volume applications", Proc. SPIE 6542, Infrared Technology and Applications XXXIII, 65421V (14 May 2007);

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