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1 May 2007 The development of affordable front-end hardware for mm-wave imaging using multilayer softboard technology
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Abstract
Millimetre-wave (mm-wave) imaging systems for a number of applications rely on a multitude of receiver modules mounted at the focal plane of focusing optics. Analysis shows that the receiver front-end forms a significant proportion of the overall cost of an imaging system restricting market take-up of commercial systems for security screening and all weather vision. The cost of imager front-ends can be significantly reduced by the use of low-cost multi-layer softboard technology used for RF printed circuit boards (PCBs) and new monolithic microwave integrated circuit (MMIC) chipsets with fewer MMIC devices. Modelled performance of W-band mm-wave imaging receiver using these techniques shows effective bandwidths of 38GHz and noise equivalent temperature difference (NETD) of 0.3K when using a 0.2ms integration time. This performance is achieved with a potential cost saving of about 60%.
© (2007) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Paul D. Munday, Jeff Powell, Dave Bannister, and Paul J. Rice "The development of affordable front-end hardware for mm-wave imaging using multilayer softboard technology", Proc. SPIE 6548, Passive Millimeter-Wave Imaging Technology X, 65480G (1 May 2007); https://doi.org/10.1117/12.723783
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