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11 May 2007 Metal Rubber materials and devices for flexible circuits, ground planes and interconnects
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Abstract
We report recent progress in the development of low modulus, highly electrically conducting thin film sheet and fabric materials and devices formed by molecular-level self-assembly processing methods and their use in flexible circuits.
© (2007) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
B. A. Davis, J. H. Lalli, A. Hill, and R. O. Claus "Metal Rubber materials and devices for flexible circuits, ground planes and interconnects", Proc. SPIE 6562, Unattended Ground, Sea, and Air Sensor Technologies and Applications IX, 65620I (11 May 2007); https://doi.org/10.1117/12.724283
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