A new micromachined sensor system for tactile measurements of high-aspect ratio microstructures

M. Balke; E. Peiner; L. Doering

doi:10.1117/12.724163

15 May 2007 A new micromachined sensor system for tactile measurements of high-aspect ratio microstructures

M. Balke, E. Peiner, L. Doering

Proceedings Volume 6589, Smart Sensors, Actuators, and MEMS III; 65890J (2007) https://doi.org/10.1117/12.724163
Event: Microtechnologies for the New Millennium, 2007, Maspalomas, Gran Canaria, Spain

Abstract

A new tactile sensor with piezoresistive read-out is presented. The sensor is designed for measurements of high aspect ratio structures with a resolution of some ten nanometer and a measuring range of hundreds of micrometer. Possible applications of the sensor are suggested. The silicon micromachining fabrication process is shown in detail next to the finite element simulations we performed. First measurements and a calibration process are described and the results are shown. The implementation into a measuring system is indicated.

Citation Download Citation

M. Balke, E. Peiner, and L. Doering "A new micromachined sensor system for tactile measurements of high-aspect ratio microstructures", Proc. SPIE 6589, Smart Sensors, Actuators, and MEMS III, 65890J (15 May 2007); https://doi.org/10.1117/12.724163

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