Translator Disclaimer
5 March 2007 Experimental research on water-jet guided laser processing
Author Affiliations +
Proceedings Volume 6595, Fundamental Problems of Optoelectronics and Microelectronics III; 659525 (2007)
Event: Fundamental Problems of Optoelectronics and Microelectronics III, 2006, Harbin, China
The water-jet guided laser processing is a new compound micro-machining process in which the laser beam passes through the water-jet by full reflection onto the workpiece. In this paper, a new key component:the coupling unit was designed and which would form a long, slim, high-pressure and stable water-jet. The couple unit made the fluid field in the chamber symmetry; the coupling quality of the laser beam and the water-jet could be easily detected by CCD camera. For its excellent surface quality, the nozzle with a &fgr; 0.18mm hole got better machining effect than other nozzles. Aiming at finding optimum machining parameters, experiments were carried out. The results showed the attenuation of laser energy bore relation to water-jet stability. The energy intensity distributed over the water-jet cross section nearly homogeneous and the laser energy nearly did not decrease in long working distance. When water-jet pressure was high, efficient cooling of the workpiece prevented burrs, cracks and heat affected zone from forming. During cutting Si wafer process, nearly no cracking was found; Adjusting reasonable laser parameters grooving 65Mn, the machining accuracy would combine with the speed.
© (2007) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Ling Li, Yang Wang, Lijun Yang, and Jiecheng Chu "Experimental research on water-jet guided laser processing", Proc. SPIE 6595, Fundamental Problems of Optoelectronics and Microelectronics III, 659525 (5 March 2007);


Water-jet-guided laser processing
Proceedings of SPIE (February 18 2003)
Pulsed Nd YAG laser cutting of silicon wafer by controlled...
Proceedings of SPIE (November 17 2010)
Wafer dicing by laser-induced thermal shock process
Proceedings of SPIE (September 27 2001)
Yag Laser Machining Center
Proceedings of SPIE (October 25 1983)

Back to Top