13 March 2007 Laser direct imaging of high density patterns on PCB covered by photoresist
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Proceedings Volume 6604, 14th International School on Quantum Electronics: Laser Physics and Applications; 660411 (2007) https://doi.org/10.1117/12.726996
Event: 14th International School on Quantum Electronics: Laser Physics and Applications, 2006, Sunny Beach, Bulgaria
Abstract
The increasing demands for miniaturization and better functionality of electronic components and devices have a significant effect on the requirements facing the printed circuit board (PCB) industry. PCB manufactures are driving for producing high density interconnect (HDI) boards at significantly reduced cost and reduced implementation time. The interconnection complexity of the PCB is still growing and today calls for 50/50 μm or 25/25 μm technology are real. Existing technologies are unable to offer acceptable solution. Recently the Laser Direct Imaging (LDI) technology is considered as an answer for these challenges. LDI is a process of imaging electric circuits directly on PCB without the use of a phototool or mask. The exposure of the photo-sensitive resist is carried out using a laser beam that is scanned across photoresist surface and switched on and off by means of a computer control system according to the electrical circuit pattern. Usually the laser used in the LDI generates a UV line, which is suitable to the commonly available photoresists. In this paper we present the laboratory system for Laser Direct Imaging and also the recent results on imaging the circuitry pattern on the PCB covered by a photosensitive resist.
© (2007) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
R. Barbucha, R. Barbucha, M. Kocik, M. Kocik, J. Mizeraczyk, J. Mizeraczyk, G. Koziol, G. Koziol, J. Borecki, J. Borecki, } "Laser direct imaging of high density patterns on PCB covered by photoresist", Proc. SPIE 6604, 14th International School on Quantum Electronics: Laser Physics and Applications, 660411 (13 March 2007); doi: 10.1117/12.726996; https://doi.org/10.1117/12.726996
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